Home > Products > Electronic adhesive
Sunstar offers a wide variety of under-fill materials which is silicon rubber modified epoxy based. This unique original technology gives following features.
- Lower internal stress and lower CTE than ordinary epoxy resin after curing.
- Lower substance warpage.
- Excellent shock resistance.
- Excellent capillary flow.
Our fine electronics materials are used in below market
Smart phone Cell phone
Lap top PC
Portable game device
Digital still camera
Comparison with conventional epoxy under-fill
Product line up
| Feature
(Application) |
Product | Curing condition |
Viscosity (mPa･s) 25℃ |
Tg (℃) |
CTE (ppm/℃) |
Modulus (GPa) |
Rework ability |
Storage condition |
|---|---|---|---|---|---|---|---|---|
| Shock resistance (Mobile device etc) |
#1027 | 120℃5min. 150℃3min. |
1,500 | 85 | 69 | 2.7 | OK | 6months under 5ﾟC |
| Thermal cycle resistance (Mobile device etc) |
#1090C | 150℃5min. | 1,800 | 165 | 58 | 3.2 | OK | 6months under -20ﾟC |
| #1090A | 150℃5min. | 1,800 | 150 | 67 | 2.7 | OK | 6months under -20ﾟC |
|
| Thermal cycle resistance (Automotive) |
#1093A | 125℃20min. | 10,000 | 120 | 38 | 6.0 | - | 6months under 5ﾟC |